Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
A Standard patent application filed on 08 August 2003 credited to Connely, Daniel J. ; Grupp, Daniel E.

Details

Application number :

2003255256  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions  

Inventor :

Connely, Daniel J. ; Grupp, Daniel E.  

Agent name :

 

Address for service :

 

Filing date :

08 August 2003  

Associated companies :

 

Applicant name :

ACORN TECHNOLOGIES, INC.  

Applicant address :

881 Alma Real Drive, Pacific Palisades, CA 90272  

Old name :

 

Original Source :

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