Process for applying a layer of branched polyamide to a substrate
A Standard patent application filed on 04 July 2003 credited to Brink, Ted ; Kroon De, Jan

Details

Application number :
2003253496  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Process for applying a layer of branched polyamide to a substrate  
Inventor :
Brink, Ted ; Kroon De, Jan  
Agent name :
 
Address for service :
 
Filing date :
04 July 2003  
Associated companies :
 
Applicant name :
DSM IP ASSETS B.V.  
Applicant address :
Het Overloon 1, NL-6411 TE Heerlen  
Old name :
 
Original Source :
Go  

Same Inventor