Details
- Application number :
- 2003251281
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Multilayer substrate metallization for ic interconnection
- Inventor :
- Ming, Li
;
Zhang, Fan
- Agent name :
-
- Address for service :
-
- Filing date :
- 26 June 2003
- Associated companies :
-
- Applicant name :
- AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
- Applicant address :
- 20 Biopolis Way
#07-01, Centros
Singapore 138668
Singapore
- Old name :
-
- Original Source :
- Go