Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
A Standard patent application filed on 14 July 2003 credited to Mine, Katsutoshi ; Ushio, Yoshito ; Fujisawa, Toyohiko ; Sutoh, Manabu

Details

Application number :

2003249594  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device  

Inventor :

Mine, Katsutoshi ; Ushio, Yoshito ; Fujisawa, Toyohiko ; Sutoh, Manabu  

Agent name :

 

Address for service :

 

Filing date :

14 July 2003  

Associated companies :

 

Applicant name :

DOW CORNING TORAY SILICONE CO., LTD.  

Applicant address :

1-3, Marunouchi 1-chome, Chiyoda-ku, Tokyo 100-0005  

Old name :

 

Original Source :

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