Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
A Standard patent application filed on 15 April 2003 credited to Leib, Jurgen ; Mund, Dietrich

Details

Application number :
2003245876  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby  
Inventor :
Leib, Jurgen ; Mund, Dietrich  
Agent name :
 
Address for service :
 
Filing date :
15 April 2003  
Associated companies :
 
Applicant name :
SCHOTT AG  
Applicant address :
Hattenbergstrasse 10, 55122 Mainz  
Old name :
 
Original Source :
Go  

Same Inventor