Flexible mold and method of manufacturing microstructure using same
A Standard patent application filed on 20 June 2003 credited to Kawai, Takayuki
;
Yokoyama, Chikafumi
Details
Application number :
2003245601
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Flexible mold and method of manufacturing microstructure using same
Inventor :
Kawai, Takayuki
;
Yokoyama, Chikafumi
Agent name :
Address for service :
Filing date :
20 June 2003
Associated companies :
Applicant name :
3M INNOVATIVE PROPERTIES COMPANY
Applicant address :
3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427