Heat curable adhesive composition, article, semiconductor apparatus and method
A Standard patent application filed on 23 June 2003 credited to Kawate, Kohichiro ; Takeuchi, Shoji ; Sakakibara, Makoto

Details

Application number :

2003243729  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Heat curable adhesive composition, article, semiconductor apparatus and method  

Inventor :

Kawate, Kohichiro ; Takeuchi, Shoji ; Sakakibara, Makoto  

Agent name :

 

Address for service :

 

Filing date :

23 June 2003  

Associated companies :

 

Applicant name :

3M INNOVATIVE PROPERTIES COMPANY  

Applicant address :

3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427  

Old name :

 

Original Source :

Go