Microwave bonding on thin film metal coated substrates
A Standard patent application filed on 20 June 2003 credited to Jackson, Henry W. ; Mai, John D. ; Pike, William T. ; Budraa, Nasser K. ; Barmatz, Martin B.

Details

Application number :

2003243710  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Microwave bonding on thin film metal coated substrates  

Inventor :

Jackson, Henry W. ; Mai, John D. ; Pike, William T. ; Budraa, Nasser K. ; Barmatz, Martin B.  

Agent name :

 

Address for service :

 

Filing date :

20 June 2003  

Associated companies :

 

Applicant name :

CALIFORNIA INSTITUTE OF TECHNOLOGY  

Applicant address :

1200 East California Boulevard, Mail Code 201-85, Pasadena, CA 91125  

Old name :

 

Original Source :

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