Electroless plating apparatus and post-electroless plating cleaning method
A Standard patent application filed on 07 July 2003 credited to Takagi, Daisuke ; Inoue, Yuki ; Wang, Xinming ; Katakabe, Ichiro

Details

Application number :

2003243015  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Electroless plating apparatus and post-electroless plating cleaning method  

Inventor :

Takagi, Daisuke ; Inoue, Yuki ; Wang, Xinming ; Katakabe, Ichiro  

Agent name :

 

Address for service :

 

Filing date :

07 July 2003  

Associated companies :

 

Applicant name :

EBARA CORPORATION  

Applicant address :

11-1, Haneda Asahi-cho, Ohta-ku, Tokyo 144-8510  

Old name :

 

Original Source :

Go