Electronic component handling device, and method for temperature application in electronic component handling device
A Standard patent application filed on 04 June 2003 credited to Nakamura, Hiroto

Details

Application number :

2003242036  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Electronic component handling device, and method for temperature application in electronic component handling device  

Inventor :

Nakamura, Hiroto  

Agent name :

 

Address for service :

 

Filing date :

04 June 2003  

Associated companies :

 

Applicant name :

ADVANTEST CORPORATION  

Applicant address :

32-1, Asahicho 1-chome, Nerima-ku, Tokyo 179-0071  

Old name :

 

Original Source :

Go  

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