Method and apparatus for connecting resin films

Application number :: 2003241710
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Method and apparatus for connecting resin films
Inventor :: Nomura, Katsunori ; Hosoda, Kazuki ; Akitomo, Tsutomu ; Takahashi, Satoshi ; Nakamura, Takuji ; Yoshimura, Kunihiro
Agent name :
Address for service :
Filing date :: 17 June 2003
Associated companies :
Applicant name :: TOYO KOHAN CO., LTD.
Applicant address :: 2-12, Yonbancho, Chiyoda-ku, Tokyo 102-8447
Old name :
Original Source :: Go

Method and apparatus for connecting resin films A Standard patent application filed on 17 June 2003 credited to Nomura, Katsunori ; Hosoda, Kazuki ; Akitomo, Tsutomu ; Takahashi, Satoshi ; Nakamura, Takuji ; Yoshimura, Kunihiro