Method and device for connecting moulded parts by means of at least one adhesive seam consisting of an adhesive that can be hardened by heat
A Standard patent application filed on 19 May 2003 credited to Sauer, Hans-Martin ; Groger, Horst ; Spiekermann, Stefan ; Elgimiabi, Sohaib ; Hempelmann, Rolf

Details

Application number :

2003240674  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and device for connecting moulded parts by means of at least one adhesive seam consisting of an adhesive that can be hardened by heat  

Inventor :

Sauer, Hans-Martin ; Groger, Horst ; Spiekermann, Stefan ; Elgimiabi, Sohaib ; Hempelmann, Rolf  

Agent name :

 

Address for service :

 

Filing date :

19 May 2003  

Associated companies :

 

Applicant name :

SUSTECH GMBH AND CO. KG  

Applicant address :

Petersenstrasse 20, 64287 Darmstadt  

Old name :

 

Original Source :

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