Copper complexes and process for formation of copper-containing thin films by using the same
A Standard patent application filed on 31 January 2003 credited to Hasegawa, Chihiro ; Kadota, Takumi ; Watanuki, Kouhei

Details

Application number :

2003239640  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Copper complexes and process for formation of copper-containing thin films by using the same  

Inventor :

Hasegawa, Chihiro ; Kadota, Takumi ; Watanuki, Kouhei  

Agent name :

 

Address for service :

 

Filing date :

31 January 2003  

Associated companies :

 

Applicant name :

UBE INDUSTRIES, LTD.  

Applicant address :

1978-96, O-Aza Kogushi, Ube-shi, Yamaguchi 755-8633  

Old name :

 

Original Source :

Go