Method for bonding thermoplastic or thermoset polymeric materials utilizing voltage applied to conductive material
A Standard patent application filed on 09 January 2003 credited to Macdonald, David M.

Details

Application number :

2003235673  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method for bonding thermoplastic or thermoset polymeric materials utilizing voltage applied to conductive material  

Inventor :

Macdonald, David M.  

Agent name :

 

Address for service :

 

Filing date :

09 January 2003  

Associated companies :

 

Applicant name :

LAMINATIONS, INC.  

Applicant address :

P.O.Box 2021, Scranton, PA 18509  

Old name :

 

Original Source :

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