Details

Application number :
2003235673  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method for bonding thermoplastic or thermoset polymeric materials utilizing voltage applied to conductive material  
Inventor :
Macdonald, David M.  
Agent name :
 
Address for service :
 
Filing date :
09 January 2003  
Associated companies :
 
Applicant name :
LAMINATIONS, INC.  
Applicant address :
P.O.Box 2021, Scranton, PA 18509  
Old name :
 
Original Source :
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Same Inventor