Details

Application number :
2003235329  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Circuit board, process for producing the same and power module  
Inventor :
Nagatomo, Yoshiyuki ; Nagase, Toshiyuki  
Agent name :
 
Address for service :
 
Filing date :
21 April 2003  
Associated companies :
 
Applicant name :
MITSUBISHI MATERIALS CORPORATION  
Applicant address :
5-1, Otemachi 1-chome, Chiyoda-ku, Tokyo 100-8117  
Old name :
 
Original Source :
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