Conductive paste, multilayer board including the conductive paste and process for producing the same
A Standard patent application filed on 27 May 2003 credited to Umeda, Hiroaki ; Iwai, Kiyoshi ; Murakami, Hisatoshi

Details

Application number :

2003234852  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Conductive paste, multilayer board including the conductive paste and process for producing the same  

Inventor :

Umeda, Hiroaki ; Iwai, Kiyoshi ; Murakami, Hisatoshi  

Agent name :

 

Address for service :

 

Filing date :

27 May 2003  

Associated companies :

 

Applicant name :

TATSUTA ELECTRIC WIRE AND CABLE CO., LTD.  

Applicant address :

3-1, Iwata-cho 2-chome, Higashiosaka-shi, Osaka 578-8585  

Old name :

 

Original Source :

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