Sensor package
A Standard patent application filed on 06 May 2003 credited to Bodin, Joel J.

Details

Application number :

2003234502  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Sensor package  

Inventor :

Bodin, Joel J.  

Agent name :

 

Address for service :

 

Filing date :

06 May 2003  

Associated companies :

 

Applicant name :

HONEYWELL INTERNATIONAL INC.  

Applicant address :

101 Columbia Road, P.O. Box 2245, Morristown, NJ 07960  

Old name :

 

Original Source :

Go  

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