Use of conductive electrolessly deposided etch stop layers, liner layers and via plugs in interconnect structures
A Standard patent application filed on 25 April 2003 credited to Cheng, Chin-Chang ; Hussein, Makarem ; Dubin, Valery ; Brain, Ruth ; Nguyen, Phil

Details

Application number :

2003234236  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Use of conductive electrolessly deposided etch stop layers, liner layers and via plugs in interconnect structures  

Inventor :

Cheng, Chin-Chang ; Hussein, Makarem ; Dubin, Valery ; Brain, Ruth ; Nguyen, Phil  

Agent name :

 

Address for service :

 

Filing date :

25 April 2003  

Associated companies :

 

Applicant name :

INTEL CORPORATION  

Applicant address :

2200 Mission College Boulevard, Santa Clara, CA 95052  

Old name :

 

Original Source :

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