An acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure
A Standard patent application filed on 28 May 2003 credited to Penttinen, Auvo ; Kutilainen, Terho ; Uusikartano, Matti ; Paarni, Hannu

Details

Application number :

2003233833  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

An acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure  

Inventor :

Penttinen, Auvo ; Kutilainen, Terho ; Uusikartano, Matti ; Paarni, Hannu  

Agent name :

 

Address for service :

 

Filing date :

28 May 2003  

Associated companies :

 

Applicant name :

ASPERATION OY  

Applicant address :

PL 22, FIN-02151 Espoo  

Old name :

 

Original Source :

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