Copper-nickel-silicon two phase quench substrate
A Standard patent application filed on 15 May 2003 credited to Walls, Dale R. ; Millure, David W. ; Schuster, Gary B. A. ; Myojin, Shinya ; Cox, Joseph G. ; Decristofaro, Nicholas J. ; Bye, Richard L. ; Lin, Jeng S.

Details

Application number :

2003233567  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Copper-nickel-silicon two phase quench substrate  

Inventor :

Walls, Dale R. ; Millure, David W. ; Schuster, Gary B. A. ; Myojin, Shinya ; Cox, Joseph G. ; Decristofaro, Nicholas J. ; Bye, Richard L. ; Lin, Jeng S.  

Agent name :

 

Address for service :

 

Filing date :

15 May 2003  

Associated companies :

 

Applicant name :

Metglas, Inc.  

Applicant address :

440 Allied Drive Conway, SC 29526 United States of America  

Old name :

 

Original Source :

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