Structure of a linking area formed on a high-density read-only recording medium and manufacturing/reproducing method and apparatus thereof
A Standard patent application filed on 04 June 2003 credited to Suh, Sang Woon
;
Kim, Jin Yong
Details
Application number :
2003232663
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Structure of a linking area formed on a high-density read-only recording medium and manufacturing/reproducing method and apparatus thereof
Inventor :
Suh, Sang Woon
;
Kim, Jin Yong
Agent name :
Freehills Patent & Trade Mark Attorneys
Address for service :
Level 43 101 Collins Street Melbourne VIC 3000 Australia
Filing date :
04 June 2003
Associated companies :
Applicant name :
LG Electronics Inc.
Applicant address :
20, Yoido-dong Youngdungpo-gu Seoul 150-010 Republic of Korea