Details

Application number :
2003232635  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Electronic component module and method for the production thereof  
Inventor :
Vandevelde, Bart ; Heerman, Marcel ; Van Puymbroeck, Jozef ; Beyne, Eric  
Agent name :
 
Address for service :
 
Filing date :
19 May 2003  
Associated companies :
 
Applicant name :
SIEMENS Aktiengesellschaft  
Applicant address :
Wittelsbacherplatz 2, 80333 Munchen, Germany  
Old name :
 
Original Source :
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