Aggregating multiple air interfaces with a multi-link protocol
A Standard patent application filed on 29 May 2003 credited to Rezaiifar, Ramin ; Bender, Paul E.

Details

Application number :
2003232458  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Aggregating multiple air interfaces with a multi-link protocol  
Inventor :
Rezaiifar, Ramin ; Bender, Paul E.  
Agent name :
 
Address for service :
 
Filing date :
29 May 2003  
Associated companies :
 
Applicant name :
QUALCOMM INCORPORATED  
Applicant address :
5775 Morehouse Drive, San Diego, CA 92121  
Old name :
 
Original Source :
Go  

Same Inventor