Conductive adhesive bonded semiconductor substrates for radiation imaging devices
A Standard patent application filed on 28 April 2003 credited to Vuorela, Mikko Llmari
Details
Application number :
2003232013
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Conductive adhesive bonded semiconductor substrates for radiation imaging devices