Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers
A Standard patent application filed on 13 March 2003 credited to Bason, Bulent ; Young, Douglas ; Wang, Yuchun ; Browne, Robin F. ; Truong, Tuan ; Talieh, Homayoun

Details

Application number :

2003224233  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers  

Inventor :

Bason, Bulent ; Young, Douglas ; Wang, Yuchun ; Browne, Robin F. ; Truong, Tuan ; Talieh, Homayoun  

Agent name :

 

Address for service :

 

Filing date :

13 March 2003  

Associated companies :

 

Applicant name :

NUTOOL, INC.  

Applicant address :

1655 McCandless Drive, Milpitas, CA 95035  

Old name :

 

Original Source :

Go