Bonding for a micro-electro-mechanical system (mems) and mems based devices
A Standard patent application filed on 25 February 2003 credited to Platt, William P. ; Ford, Carol M.

Details

Application number :

2003223194  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Bonding for a micro-electro-mechanical system (mems) and mems based devices  

Inventor :

Platt, William P. ; Ford, Carol M.  

Agent name :

 

Address for service :

 

Filing date :

25 February 2003  

Associated companies :

 

Applicant name :

HONEYWELL INTERNATIONAL INC.  

Applicant address :

101 Columbia Road, P.O. Box 2245, Morristown, NJ 07960  

Old name :

 

Original Source :

Go