Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly

Application number :: 2003222276
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly
Inventor :: Ali, Mir Akbar ; Peterson, Carl W.
Agent name :
Address for service :
Filing date :: 11 March 2003
Associated companies :
Applicant name :: THE BOEING COMPANY
Applicant address :: P.O. Box 3707, M/S 13-08, Seattle, WA 98124-2207
Old name :
Original Source :: Go

Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly A Standard patent application filed on 11 March 2003 credited to Ali, Mir Akbar ; Peterson, Carl W.