Substrate, wiring board, semiconductor package-use substrate, semiconductor package and production methods for them
A Standard patent application filed on 20 March 2003 credited to Suzuki, Kazuhisa ; Nagoshi, Toshimasa ; Shimada, Osamu ; Kikuchi, Mitsuo

Details

Application number :

2003220938  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Substrate, wiring board, semiconductor package-use substrate, semiconductor package and production methods for them  

Inventor :

Suzuki, Kazuhisa ; Nagoshi, Toshimasa ; Shimada, Osamu ; Kikuchi, Mitsuo  

Agent name :

 

Address for service :

 

Filing date :

20 March 2003  

Associated companies :

 

Applicant name :

HITACHI CHEMICAL CO., LTD.  

Applicant address :

1-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0449  

Old name :

 

Original Source :

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