Hybrid leaf spring with reinforced bond lines
A Standard patent application filed on 18 March 2003 credited to Gordon, D. Michael
;
Meatto, Frank
;
Pilpel, Edward
;
Gordon, David C. Jr.
Details
Application number :
2003218200
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Hybrid leaf spring with reinforced bond lines
Inventor :
Gordon, D. Michael
;
Meatto, Frank
;
Pilpel, Edward
;
Gordon, David C. Jr.