System and method for leak rate testing during adiabatic cooling
A Standard patent application filed on 05 March 2003 credited to Ekblad, Mark K. ; Rutherford, James M.

Details

Application number :

2003217960  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

System and method for leak rate testing during adiabatic cooling  

Inventor :

Ekblad, Mark K. ; Rutherford, James M.  

Agent name :

 

Address for service :

 

Filing date :

05 March 2003  

Associated companies :

 

Applicant name :

USON, L.L.P.  

Applicant address :

5215 Hollister, Houston, TX 77040  

Old name :

 

Original Source :

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