Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
A Standard patent application filed on 24 February 2003 credited to Petroski, Angela ; Petroski, James P. ; Cooper, Richard D. ; Fathauer, Paul ; Yasnic, Marc A.

Details

Application number :

2003217744  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same  

Inventor :

Petroski, Angela ; Petroski, James P. ; Cooper, Richard D. ; Fathauer, Paul ; Yasnic, Marc A.  

Agent name :

 

Address for service :

 

Filing date :

24 February 2003  

Associated companies :

 

Applicant name :

RAYTECH INNOVATIVE SOLUTIONS, INC.  

Applicant address :

609 E. Chaney Street, Sullivan, IN 47882  

Old name :

 

Original Source :

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