A method and system for monitoring and profiling an integrated circuit die temperature
A Standard patent application filed on 19 February 2003 credited to Gauthier, Claude R. ; Siegel, Joseph R. ; Boyle, Steven R. ; Gold, Spencer M. ; House, Kennth A.

Details

Application number :

2003216355  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A method and system for monitoring and profiling an integrated circuit die temperature  

Inventor :

Gauthier, Claude R. ; Siegel, Joseph R. ; Boyle, Steven R. ; Gold, Spencer M. ; House, Kennth A.  

Agent name :

 

Address for service :

 

Filing date :

19 February 2003  

Associated companies :

 

Applicant name :

SUN MICROSYSTEMS, INC.  

Applicant address :

4150 Network Circle, Santa Clara, CA 95054  

Old name :

 

Original Source :

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