Tiered structure having a multi-layered resist stack
A Standard patent application filed on 04 February 2003 credited to Mancini, David P. ; Popovich, Laura ; Gehoski, Kathleen Ann ; Resnick, Doug J.

Details

Application number :

2003215061  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Tiered structure having a multi-layered resist stack  

Inventor :

Mancini, David P. ; Popovich, Laura ; Gehoski, Kathleen Ann ; Resnick, Doug J.  

Agent name :

 

Address for service :

 

Filing date :

04 February 2003  

Associated companies :

 

Applicant name :

Freescale Semiconductor, Inc.  

Applicant address :

6501 William Cannon Drive West Austin, TX 78735 United States of America  

Old name :

 

Original Source :

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