Thinner composition for removing photosensitive resin
A Standard patent application filed on 28 March 2003 credited to Lee, Sang-Dai ; Jun, Woo-Sik ; Park, Soon-Hee

Details

Application number :

2003214682  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Thinner composition for removing photosensitive resin  

Inventor :

Lee, Sang-Dai ; Jun, Woo-Sik ; Park, Soon-Hee  

Agent name :

 

Address for service :

 

Filing date :

28 March 2003  

Associated companies :

 

Applicant name :

DONGJIN SEMICHEM CO., LTD.  

Applicant address :

Gajwa-dong 472-2, Seo-ku, Incheon-city 405-250  

Old name :

 

Original Source :

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