Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
A Standard patent application filed on 05 March 2003 credited to Sueyoshi, Takayuki
;
Takai, Kenji
Details
Application number :
2003211704
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
Inventor :
Sueyoshi, Takayuki
;
Takai, Kenji
Agent name :
Address for service :
Filing date :
05 March 2003
Associated companies :
Applicant name :
HITACHI CHEMICAL CO., LTD.
Applicant address :
1-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0449