High shrink sewing machine thread
A Standard patent application filed on 11 March 2003 credited to Obora, Kenji ; Nakayama, Genji

Details

Application number :

2003211571  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High shrink sewing machine thread  

Inventor :

Obora, Kenji ; Nakayama, Genji  

Agent name :

 

Address for service :

 

Filing date :

11 March 2003  

Associated companies :

 

Applicant name :

TEIJIN LIMITED  

Applicant address :

6-7, Minamihommachi 1-chome, Chuo-ku, Osaka-shi, Osaka 541-0054  

Old name :

 

Original Source :

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