Lamination apparatus and methods
A Standard patent application filed on 11 February 2003 credited to Hirsch, Donald I.
;
Bader, William F.
;
Ripley, Scott A.
Details
Application number :
2003211008
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Lamination apparatus and methods
Inventor :
Hirsch, Donald I.
;
Bader, William F.
;
Ripley, Scott A.
Agent name :
Address for service :
Filing date :
11 February 2003
Associated companies :
Applicant name :
3M INNOVATIVE PROPERTIES COMPANY
Applicant address :
3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427