Silicone resin composition, curable resin composition, and cured resin
A Standard patent application filed on 14 February 2003 credited to Furukawa, Haruhiko ; Morita, Yoshitsugu ; Nakanishi, Koji ; Ueki, Hiroshi

Details

Application number :
2003208009  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Silicone resin composition, curable resin composition, and cured resin  
Inventor :
Furukawa, Haruhiko ; Morita, Yoshitsugu ; Nakanishi, Koji ; Ueki, Hiroshi  
Agent name :
 
Address for service :
 
Filing date :
14 February 2003  
Associated companies :
 
Applicant name :
DOW CORNING TORAY SILICONE CO., LTD.  
Applicant address :
1-3, Marunouchi 1-chome, Chiyoda-ku, Tokyo 100-0005  
Old name :
 
Original Source :
Go  

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