Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing
A Standard patent application filed on 09 January 2003 credited to Yao, Gongda ; Xu, Zheng ; Wang, Hougong

Details

Application number :

2003207497  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing  

Inventor :

Yao, Gongda ; Xu, Zheng ; Wang, Hougong  

Agent name :

 

Address for service :

 

Filing date :

09 January 2003  

Associated companies :

 

Applicant name :

APPLIED MATERIALS, INC.  

Applicant address :

3050 Bowers Avenue, Santa Clara, CA 95054  

Old name :

 

Original Source :

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