Stacked die in die bga package
A Standard patent application filed on 09 January 2003 credited to Chew, Beng Chye ; Neo, Chee Peng ; Pour, Cheng Poh ; Tan, Victor Cher Khng ; Tan, Michael Kian Shing ; Lim, Thiam Chye ; Tan, Hock Chuan

Details

Application number :

2003207484  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Stacked die in die bga package  

Inventor :

Chew, Beng Chye ; Neo, Chee Peng ; Pour, Cheng Poh ; Tan, Victor Cher Khng ; Tan, Michael Kian Shing ; Lim, Thiam Chye ; Tan, Hock Chuan  

Agent name :

 

Address for service :

 

Filing date :

09 January 2003  

Associated companies :

 

Applicant name :

MICRON TECHNOLOGY, INC  

Applicant address :

8000 S.Federal Way, Boise, ID 83706-9632  

Old name :

 

Original Source :

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