Process for production of pressure-sensitive adhesive moldings comprising crosslinked polymers as the main component
A Standard patent application filed on 24 January 2003 credited to Higo, Naruhito ; Yamaguchi, Toshiro ; Tateishi, Tetsuro ; Yasukochi, Takashi

Details

Application number :

2003203380  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Process for production of pressure-sensitive adhesive moldings comprising crosslinked polymers as the main component  

Inventor :

Higo, Naruhito ; Yamaguchi, Toshiro ; Tateishi, Tetsuro ; Yasukochi, Takashi  

Agent name :

 

Address for service :

 

Filing date :

24 January 2003  

Associated companies :

 

Applicant name :

HISAMITSU PHARMACEUTICAL CO., INC.  

Applicant address :

408, Tashirodaikanmachi, Tosu-shi, Saga 841-0017  

Old name :

 

Original Source :

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Same Inventor

• Pressure-sensitive adhesive and patch employing the same