Details

Application number :
2003202492  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Semiconductor wafer protective member and semiconductor wafer grinding method  
Inventor :
Kimura, Yusuke ; Yajima, Koichi  
Agent name :
 
Address for service :
 
Filing date :
09 January 2003  
Associated companies :
 
Applicant name :
DISCO CORPORATION  
Applicant address :
14-3, Higashi Kojiya 2-chome, Ota-ku, Tokyo 144-0033  
Old name :
 
Original Source :
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Same Inventor