Semiconductor wafer protective member and semiconductor wafer grinding method
A Standard patent application filed on 09 January 2003 credited to Kimura, Yusuke
;
Yajima, Koichi
Details
Application number :
2003202492
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Semiconductor wafer protective member and semiconductor wafer grinding method
Inventor :
Kimura, Yusuke
;
Yajima, Koichi
Agent name :
Address for service :
Filing date :
09 January 2003
Associated companies :
Applicant name :
DISCO CORPORATION
Applicant address :
14-3, Higashi Kojiya 2-chome, Ota-ku, Tokyo 144-0033