Heat-sensitive pressure-sensitive adhesive composition
A Standard patent application filed on 08 January 2003 credited to Kobayashi, Kouji ; Tokushige, Tadafumi ; Suga, Mamoru

Details

Application number :

2003201913  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Heat-sensitive pressure-sensitive adhesive composition  

Inventor :

Kobayashi, Kouji ; Tokushige, Tadafumi ; Suga, Mamoru  

Agent name :

 

Address for service :

 

Filing date :

08 January 2003  

Associated companies :

 

Applicant name :

API CORPORATION  

Applicant address :

4-9, Hiranomachi 2-chome, Chuo-ku, Osaka-shi, Osaka 541-0046  

Old name :

 

Original Source :

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