Compound semiconductor multilayer structure, hall device, and hall device manufacturing method
A Standard patent application filed on 15 January 2003 credited to Oyama, Akihiko ; Yoshida, Takashi ; Shibata, Yoshihiko ; Ujihara, Tsuyoshi ; Watanabe, Takayuki

Details

Application number :

2003201894  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Compound semiconductor multilayer structure, hall device, and hall device manufacturing method  

Inventor :

Oyama, Akihiko ; Yoshida, Takashi ; Shibata, Yoshihiko ; Ujihara, Tsuyoshi ; Watanabe, Takayuki  

Agent name :

 

Address for service :

 

Filing date :

15 January 2003  

Associated companies :

 

Applicant name :

ASAHI KASEI ELECTRONICS CO., LTD.  

Applicant address :

23-7, Nishi-shinjuku 1-chome Shinjuku-ku Tokyo 160-0023 Japan  

Old name :

 

Original Source :

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