Temperature compensated photonic package
A Standard patent application filed on 24 January 2003 credited to Thorncraft, David Allen ; Harris, John Laurence ; Robinson, David John

Details

Application number :

2003201407  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Temperature compensated photonic package  

Inventor :

Thorncraft, David Allen ; Harris, John Laurence ; Robinson, David John  

Agent name :

 

Address for service :

 

Filing date :

24 January 2003  

Associated companies :

 

Applicant name :

BISHOP MANUFACTURING TECHNOLOGY LIMITED  

Applicant address :

10 Waterloo Road, North Ryde, NSW 2113  

Old name :

 

Original Source :

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