Mold for used in multi flip-chip underfill encapsulation process
A Standard patent application filed on 09 December 2002 credited to Seo, Hwa-Il
;
Han, Se-Jin
;
Kim, Kwang-Sun
Details
Application number :
2002366673
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Mold for used in multi flip-chip underfill encapsulation process
Inventor :
Seo, Hwa-Il
;
Han, Se-Jin
;
Kim, Kwang-Sun
Agent name :
Address for service :
Filing date :
09 December 2002
Associated companies :
Applicant name :
HAN, Se-Jin
Applicant address :
Semiconductor Equipment Technology Education Centor, Korea University of Technology and Education, 307, GaJeon-ri, ByongChon-myen, Cheonan-shi, 330-708 Chung Cheong Nam Do