Method and apparatus for producing semiconductor preforms
A Standard patent application filed on 10 February 2000 credited to Chin, Neep Hing ; Low, Wan Toh ; Koh, Koon Hong

Details

Application number :

28414  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for producing semiconductor preforms  

Inventor :

Chin, Neep Hing ; Low, Wan Toh ; Koh, Koon Hong  

Agent name :

 

Address for service :

 

Filing date :

10 February 2000  

Associated companies :

 

Applicant name :

Cookson Semiconductor Packaging Materials  

Applicant address :

 

Old name :

 

Original Source :

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