Heated embossing and ply bonding process
A Standard patent application filed on 26 November 2002 credited to Gunn, Alexander, F.
;
Vanderheiden, Daniel, J.
;
Carlow, Geoffrey, F.
;
Wood, James, A.
;
Ferguson, Timothy, D.
;
Pauling, Paul, K.
;
Wendler Jr, Roger, E.
;
Baum, Tammy, L.
;
Baggot, James, L.
Details
Application number :
2002363951
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Heated embossing and ply bonding process
Inventor :
Gunn, Alexander, F.
;
Vanderheiden, Daniel, J.
;
Carlow, Geoffrey, F.
;
Wood, James, A.
;
Ferguson, Timothy, D.
;
Pauling, Paul, K.
;
Wendler Jr, Roger, E.
;
Baum, Tammy, L.
;
Baggot, James, L.
Agent name :
Spruson & Ferguson
Address for service :
Level 35 St Martins Tower 31 Market Street Sydney NSW 2000 Australia
Filing date :
26 November 2002
Associated companies :
Applicant name :
Kimberly-Clark Worldwide, Inc.
Applicant address :
401 N. Lake Street Neenah Wisconsin 54956 United States of America