Integrated void-free process for assembling a solder bumped chip
A Standard patent application filed on 14 November 2002 credited to Lee, Ning-Cheng ; Yin, Wusheng ; Wang, Shanger

Details

Application number :

2002360391  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Integrated void-free process for assembling a solder bumped chip  

Inventor :

Lee, Ning-Cheng ; Yin, Wusheng ; Wang, Shanger  

Agent name :

 

Address for service :

 

Filing date :

14 November 2002  

Associated companies :

 

Applicant name :

INDIUM CORPORATION OF AMERICA  

Applicant address :

1676 Lincoln Avenue, P.O. Box 269, Utica, NY 13503  

Old name :

 

Original Source :

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