Polyamide resin compositions with electromagnetic interference shielding properties and articles formed therefrom
A Standard patent application filed on 19 December 2002 credited to Saga, Yuji ; Cheng, Paul P.

Details

Application number :

2002357920  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polyamide resin compositions with electromagnetic interference shielding properties and articles formed therefrom  

Inventor :

Saga, Yuji ; Cheng, Paul P.  

Agent name :

 

Address for service :

 

Filing date :

19 December 2002  

Associated companies :

 

Applicant name :

E.I. DU PONT DE NEMOURS AND COMPANY  

Applicant address :

1007 Market Street, Wilmington, DE 19898  

Old name :

 

Original Source :

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